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rf & protection devices data sheet revision 3.0, 2014-01-24 BGA924N6 silicon germanium low noise amplifier for global navigation sa tellite systems (gnss)
edition 2014-01-24 published by infineon technologies ag 81726 munich, germany ? 2014 infineon technologies ag all rights reserved. legal disclaimer the information given in this docu ment shall in no event be regarded as a guarantee of conditions or characteristics. with respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, infine on technologies hereby disclaims any and all warranties and liabilities of any kind, including witho ut limitation, warranties of non-infrin gement of intellectua l property rights of any third party. information for further information on technology, delivery terms and conditions and prices, please contact the nearest infineon technologies office ( www.infineon.com ). warnings due to technical requirements, components may contain dangerous substances. for information on the types in question, please contact the nearest infineon technologies office. infineon technologies compon ents may be used in life-su pport devices or systems only with the express written approval of infineon technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safe ty or effectiveness of that de vice or system. life support devices or systems are intended to be implanted in the hu man body or to support an d/or maintain and sustain and/or protect human life. if they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
BGA924N6 data sheet 3 revision 3.0, 2014-01-24 trademarks of infineon technologies ag aurix?, c166?, canpak?, ci pos?, cipurse?, econopac k?, coolmos?, coolset?, corecontrol?, crossav e?, dave?, di-pol?, easypim?, econobridge?, econodual?, econopim?, econopack?, eicedriver?, eupec?, fcos?, hitfet?, hybridpack?, i2rf?, isoface?, isopack?, mipaq?, modstack?, my-d?, novalithic?, optimos?, origa?, powercode?; primarion?, pr imepack?, primestack?, pr o-sil?, profet?, rasic?, reversave?, satric?, si eget?, sindrion?, sipmos?, smartl ewis?, solid flash?, tempfet?, thinq!?, trenchstop?, tricore?. other trademarks advance design system? (ads) of agilent te chnologies, amba?, arm?, multi-ice?, keil?, primecell?, realview?, thumb?, vision? of arm limited, uk. autosar? is licensed by autosar development partnership. bluetooth? of bluetooth sig inc. cat-iq? of dect forum. colossus?, firstgps? of trimble navigation ltd. emv? of emvc o, llc (visa holdings in c.). epcos? of epcos ag. flexgo? of microsoft corp oration. flexray? is licensed by flexray consortium. hyperterminal? of hilgraeve incorporated. iec? of commission electrot echnique internationale. irda? of infrared data association corporation. iso? of international organi zation for standardization. matlab? of mathworks, inc. maxim? of maxim integrated pr oducts, inc. microtec?, nucleus? of mentor graphics corporation. mipi? of mipi allianc e, inc. mips? of mips technologies, inc., u sa. murata? of murata manufacturing co., microwave office? (mwo) of applied wave research inc., omnivision? of omnivision technologies, inc. openwave? openwave systems inc. red hat? red hat, inc. rfmd? rf micro devices, inc. sirius? of si rius satellite radio inc. solaris? of sun microsystems, inc. spansion? of spansion llc ltd. symbian? of symbian software limited. taiyo yuden? of taiyo yuden co. teaklite? of ceva, inc. tektro nix? of tektronix inc. toko? of toko kabushiki kaisha ta. unix? of x/open company limited. verilo g?, palladium? of cadence design systems, inc. vlynq? of texas instruments incorpor ated. vxworks?, wind river? of wind ri ver systems, inc. zetex? of diodes zetex limited. last trademarks update 2011-11-11 revision history page or item subjects (major changes since previous revision) revision 3.0, 2014-01-24 all ?preliminary? status removed revision 2.0, 2013-07-13 all preliminary data sheet 14, 15 package drawings and information completed 7, 8, 10, 11 electrical characteristics adjusted
BGA924N6 table of contents data sheet 4 revision 3.0, 2014-01-24 table of contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 list of figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 list of tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 1 maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3 application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 4 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 table of contents
BGA924N6 list of figures data sheet 5 revision 3.0, 2014-01-24 figure 1 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 figure 2 application schematic BGA924N6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 figure 3 drawing of application board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 figure 4 application board cross-section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 figure 5 tsnp-6-2 package outline (top, side and bottom views) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 figure 6 footprint tsnp-6-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 figure 7 marking layout (top view). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 figure 8 tape & reel dimensions (reel diameter 180 mm, piec es/reel 15000) . . . . . . . . . . . . . . . . . . . . . . 15 list of figures
BGA924N6 list of tables data sheet 6 revision 3.0, 2014-01-24 table 1 pin definition and function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 table 2 maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 table 3 thermal resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 table 4 electrical characteristics: t a = 25 c, v cc = 1.8 v, v pon,on = 1.8 v, v pon,off = 0 v, f = 1550 - 1615 mhz (gps / glonass / beidou / galileo) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 table 5 electrical characteristics: t a = 25 c, v cc = 2.8 v, v pon,on = 2.8 v, v pon,off = 0 v, f = 1550 - 1615 mhz (gps / glonass / beidou / galileo) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 table 6 bill of materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 list of tables
product name marking package BGA924N6 j tsnp-6-2 silicon germanium low noise amplifier for global navigation satellite systems (gnss) BGA924N6 data sheet 7 revision 3.0, 2014-01-24 features ? high insertion power gain: 16.2db ? out-of-band input 3rd order intercept point: +10dbm ? input 1 db compression point: -5 dbm ? low noise figure: 0.55 db ? very low current consumption: 4.8 ma ? operating frequencies: 1550 - 1615 mhz ? supply voltage: 1.5 v to 3.3 v ? digital on/off switch (1v logic high level) ? ultra small tsnp-6-2 leadless package (footprint: 0.7 x 1.1 mm 2 ) ? b7hf silicon germ anium technology ? rf output internally matched to 50 ? only 1 external smd component necessary ? 2kv hbm esd protection (including ai-pin) ? pb-free (rohs compliant) package application ? ideal for all global navigation satellite systems (gnss) like gps, glonass, beidou, galileo and others figure 1 block diagram bga 524n6_blockdiagram .vsd ai ao gnd pon vcc esd
BGA924N6 features data sheet 8 revision 3.0, 2014-01-24 description the BGA924N6 is a front-end low nois e amplifier for global navigation sa tellite systems (gnss) from 1550 mhz to 1615 mhz like gps, glonass, bei dou, galileo and others. the lna provid es 16.2 db gain and 0.55 db noise figure at a current consumption of 4.8 ma in the application configuration described in chapter 3 . the BGA924N6 is based upon infineo n technologies? b7hf silicon ge rmanium technology. it operates from 1.5 v to 3.3 v supply voltage. pin definition and function table 1 pin definition and function pin no. name function 1 gnd ground 2 vcc dc supply 3 ao lna output 4 gnd ground 5 ai lna input 6 pon power on control
BGA924N6 maximum ratings data sheet 9 revision 3.0, 2014-01-24 1 maximum ratings attention: stresses above the max. values listed here may cause permanent damage to the device. exposure to absolute maximum rating conditions for extended periods may affect device reliability. maximum ratings are absolute ratings; exceeding only one of these values may cause irreversible damage to the integrated circuit. thermal resistance table 2 maximum ratings parameter symbol values unit note / test condition min. typ. max. voltage at pin vcc v cc -0.3 ? 3.6 v 1) 1) all voltages refer to gnd-node unless otherwise noted voltage at pin ai v ai -0.3 ? 0.9 v ? voltage at pin ao v ao -0.3 ? v cc + 0.3 v ? voltage at pin pon v pon -0.3 ? v cc + 0.3 v ? voltage at pin gndrf v gndrf -0.3 ? 0.3 v ? current into pin vcc i cc ??16ma? rf input power p in ??0dbm? total power dissipation, t s < 148 c 2) 2) t s is measured on the ground lead at the soldering point p tot ??60mw? junction temperature t j ??150c? ambient temperature range t a -40 ? 85 c ? storage temperature range t stg -65 ? 150 c ? esd capability all pins v esd_hbm ? ? 2000 v according to jesd22a-114 table 3 thermal resistance parameter symbol value unit junction - soldering point 1) 1) for calculation of r thja please refer to application note thermal resistance r thjs 25 k/w
BGA924N6 electrical characteristics data sheet 10 revision 3.0, 2014-01-24 2 electrical characteristics table 4 electrical characteristics: 1) t a = 25 c, v cc = 1.8 v, v pon,on = 1.8 v, v pon,off = 0 v, f = 1550 - 1615 mhz (gps / glonass / beidou / galileo) 1) based on the application described in chapter 3 parameter symbol values unit note / test condition min. typ. max. supply voltage v cc 1.5 ? 3.3 v ? supply current i cc ?4.8?maon-mode ?0.23 a off-mode power on voltage v pon 1.0 ? vcc v on-mode 0 ? 0.4 v off-mode power on current i pon ?5? a on-mode ??1 a off-mode insertion power gain | s 21 | 2 ? 16.2 ? db ? noise figure 2) 2) pcb losses are subtracted nf ?0.55?db z s =50 input return loss rl in ?13?db? output return loss rl out ?18?db? reverse isolation 1/| s 12 | 2 ?23?db? power gain settling time 3) 3) to be within 1 db of the final gain off- to on-mode; to be within 3 db of the final gain on- to off-mode t s ?5? s off- to on-mode ?5? s on- to off-mode inband input 1db-compression point ip 1db ?-8?dbm? inband input 3 rd -order intercept point 4) 4) input power = -30 dbm for each tone iip 3 ?+3?dbm f 1 = 1575 mhz f 2 = f 1 +/-1 mhz out-of-band input 3 rd -order intercept point 5) 5) input power = -20 dbm for each tone iip 3oob ?+10?dbm f 1 = 1712.7 mhz f 2 = 1850 mhz stability k ?> 1? f = 20 mhz ... 10 ghz
BGA924N6 electrical characteristics data sheet 11 revision 3.0, 2014-01-24 table 5 electrical characteristics: 1) t a = 25 c, v cc = 2.8 v, v pon,on = 2.8 v, v pon,off = 0 v, f = 1550 - 1615 mhz (gps / glonass / beidou / galileo) 1) based on the application described in chapter 3 parameter symbol values unit note / test condition min. typ. max. supply voltage v cc 1.5 ? 3.3 v ? supply current i cc ?4.9?maon-mode ?0.23 a off-mode power on voltage v pon 1.0 ? vcc v on-mode 0 ? 0.4 v off-mode power on current i pon ?10? a on-mode ??1 a off-mode insertion power gain | s 21 | 2 ? 16.2 ? db ? noise figure 2) 2) pcb losses are subtracted nf ?0.55?db z s =50 input return loss rl in ?13?db? output return loss rl out ?20?db? reverse isolation 1/| s 12 | 2 ?23?db? power gain settling time 3) 3) to be within 1 db of the final gain off- to on-mode; to be within 3 db of the final gain on- to off-mode t s ?5? s off- to on-mode ?5? s on- to off-mode inband input 1db-compression point ip 1db ?-5?dbm? inband input 3 rd -order intercept point 4) 4) input power = -30 dbm for each tone iip 3 ?+4?dbm f 1 = 1575 mhz f 2 = f 1 +/-1 mhz out-of-band input 3 rd -order intercept point 5) 5) input power = -20 dbm for each tone iip 3oob ?+10?dbm f 1 = 1712.7 mhz f 2 = 1850 mhz stability k ?> 1? f = 20 mhz ... 10 ghz
BGA924N6 application information data sheet 12 revision 3.0, 2014-01-24 3 application information application board configuration figure 2 application schematic BGA924N6 a list of all application notes is available at http://www.infineon.com/gpslna.appnotes . table 6 bill of materials name value package manufacturer function c1 (optional) 1nf 0402 various dc block 1) 1) dc block might be realized with pre-filter in gnss applications c2 (optional) > 10nf 2) 2) for data sheet characteristics 1 f used 0402 various rf bypass 3) 3) rf bypass recommended to mitigate power supply noise l1 8.2nh 0402 murata lqw type input matching n1 BGA924N6 tsnp-6-2 infineon sige lna bga924 n6_schematic.vsd n1 BGA924N6 ai, 5 pon, 6 gndrf, 4 gnd, 1 ao, 3 vcc, 2 c1 (optional) l1 rfin pon vcc c2 (optional) rfout
BGA924N6 application information data sheet 13 revision 3.0, 2014-01-24 figure 3 drawing of application board figure 4 application board cross-section bgax24n6_application _board .vsd copper 35 m vias vias ro4003, 0.2mm fr4,0.8mm bgax24n6_application _board _sideview.vsd
BGA924N6 package information data sheet 14 revision 3.0, 2014-01-24 4 package information figure 5 tsnp-6-2 package outline (top, side and bottom views) figure 6 footprint recommendation tsnp-6-2 figure 7 marking layout (top view) 0.02 max. 0.05 0.7 0.05 0.2 0.05 1) 0.05 0.2 1) 0.4 1.1 0.05 1) dimension applies to plated terminals 5 2 6 4 1 3 top view bottom view pin 1 marking tsnp-6-2-po v01 0.8 0.05 +0.025 0.375 -0.015 0.25 0.4 0.25 0.4 0.25 0.4 0.25 0.4 tsnp-6-2-fp v01 stencil apertures copper solder mask (stencil thickness 100 m) nsmd type code monthly data code tsnp-6-2-mk v01 pin 1 marking 1
BGA924N6 package information data sheet 15 revision 3.0, 2014-01-24 figure 8 tape & reel dimensions (reel diameter 180 mm, pieces/reel 15000) 2 0.5 pin 1 marking tsnp-6-2-tp v01 0.85 1.25 8
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